Machine à souder à la vague de bureau TB680
- Fiche technique
Summary
La machine à souder à la vague de bureau TB680 a été développée par Torch, c'est le premier équipement dans le domaine de la soudure à la vague de type petit. TB680 convient aux centres de recherche, à l'industrie de la guerre, aux petites et moyennes entreprises, aux petites entreprises privées et à d'autres sociétés de production électronique. Il s'agit d'un type de bureau, occupant une petite pièce, avec des fonctions multiples, économes en énergie et à haut rendement. L'opération est facile et particulièrement adaptée à la production de petites et moyennes séries.
Principaux paramètres techniques
| Puissance maximum | 3kW |
| Capacité de la marmite | 37Kg tin |
| Taille maximale du circuit imprimé | 200X270mm (max) |
| Plage de température | 200-300℃ Affichage LED |
| Température de préchauffage | 70-90℃ |
| Plage de hauteur de la crête des vagues | 5-12mm |
| Temps de fusion | 80min |
| Pulvérisation de flux | mousse |
| Source de courant | 220V±1%V AC monophasé 50Hz (veuillez connecter l'alimentation à la terre) |
| Vitesse de transmission | 0.5-3m/min |
| Dimension | 850X600X330mm |
| Poids net | 48Kg |
Function:
There are 6 parts: flux, preheating, soldering, electrical controlling, exhaust unit and convection unit.
Flux
Flux parts are made of air pump, air tube, pin valve, filter, froth tube and flux box.
There is flux belt on the froth tube, PCB whose side has chips is on the top and touch flux, the side will has flux film.
preheating
It is made by melt board with resistor to provide heat for PCB.
soldering
It is made by tin pot, heating board, wave pump and tin.
1 tin pot
2 clapboard
3 nozzle
4 regulator
5 wave pump
6 channel
Soldering
Figure 3: The solder will be divided into upper and lower levels by clapboard, the lower for the high-pressure layer, the upper layer for the low-pressure layer, liquid solder will be into high pressure layer driven by wave pump, the solder in the high pressure layer rotate and then pass regulator, it will overflow from the nozzle, the wave crest form and then fall into low pressure layer because of gravity
4 electrical controlling
With modular structure, Vitesse de transmission, solder temperature, preheating time and others can be adjusted and controlled. Working principle is shown in Figure 4.
exhaust unit
It is made of cover, air fan, air cover and air tube. All exhaust generated in soldering will be eliminated.
convection unit
It is made of chain, rail, drive and pallet. PCB will be sent in flux unit, preheating unit and soldering unit by convection unit.
